Product Application:
The base board of FPC for electronic products.
Product Features:
- High volume commercialized flexible film constructed by polyimide and copper layer
- High Tg, excellent flame resistance and outstanding mechanical strength
- High dimensional stability after thermal process
- Low moisture absorption rate and high moisture resistance
- Excellent dielectric properties
- UL 94 V-0 , VTM-0 certified flame resistance rating
- RoHS compliant
Product Category and Product Line:
| Product Category |
Product Series |
2L Single Side
| Copper Foil |
| Casting PI Layer |
|
Casting PI Series (2LP) |
| Ultra Thin Series |
| High Transparency Series |
2L Double Side
| Copper Foil |
| PI Film + TPI |
| Copper Foil |
|
TAIFLEX TPI Series (2TP,2OP) |
| TPI Series (2FP/2BP/2VP) |
| Ultra Thin Series |
| High Transparency Series |
